Package: kmod-hwmon-w83793
Version: 4.9.130-1
Depends: kernel (=4.9.130-1-c2f59774100f54fc6cffd2b7f1605734), kmod-hwmon-core, kmod-i2c-core, kmod-hwmon-vid
Source: package/kernel/linux
License: GPL-2.0
Section: kernel
Architecture: aarch64_generic
Installed-Size: 15351
Description:  Kernel module for the Winbond W83793G and W83793R chips.
