Package: kmod-hwmon-w83793
Version: 4.14.50-1
Depends: kernel (=4.14.50-1-123e251f45b559e4b0caa67ab112d367), kmod-hwmon-core, kmod-i2c-core, kmod-hwmon-vid
Source: package/kernel/linux
License: GPLv2
Section: kernel
Architecture: arm_xscale
Installed-Size: 13741
Description:  Kernel module for the Winbond W83793G and W83793R chips.
