Package: kmod-hwmon-w83793
Version: 4.9.110-1
Depends: kernel (=4.9.110-1-3cd528a3e1386eaafd8ed74282c05c0a), kmod-hwmon-core, kmod-i2c-core, kmod-hwmon-vid
Source: package/kernel/linux
License: GPLv2
Section: kernel
Architecture: armeb_xscale
Installed-Size: 13730
Description:  Kernel module for the Winbond W83793G and W83793R chips.
