Package: kmod-hwmon-w83793
Version: 4.14.103-1
Depends: kernel (=4.14.103-1-1b1a05f198ee53a32b51fac0d2106675), kmod-hwmon-core, kmod-i2c-core, kmod-hwmon-vid
Source: package/kernel/linux
SourceName: kmod-hwmon-w83793
License: GPL-2.0
Section: kernel
Architecture: arm_fa526
Installed-Size: 14092
Description:  Kernel module for the Winbond W83793G and W83793R chips.
