Package: kmod-hwmon-w83793
Version: 4.14.82-1
Depends: kernel (=4.14.82-1-205032a066b10c1219e134537171e2a2), kmod-hwmon-core, kmod-i2c-core, kmod-hwmon-vid
Source: package/kernel/linux
License: GPL-2.0
Section: kernel
Architecture: arc_arc700
Installed-Size: 19673
Description:  Kernel module for the Winbond W83793G and W83793R chips.
