Package: kmod-hwmon-w83793
Version: 4.14.176-1
Depends: kernel (=4.14.176-1-6324c279fa5fc30146d78bb311641940), kmod-hwmon-core, kmod-i2c-core, kmod-hwmon-vid
Source: package/kernel/linux
SourceName: kmod-hwmon-w83793
License: GPL-2.0
Section: kernel
Architecture: arc_arc700
Installed-Size: 19492
Description:  Kernel module for the Winbond W83793G and W83793R chips.
