Package: kmod-hwmon-w83793
Version: 4.14.172-1
Depends: kernel (=4.14.172-1-17386d91dd8dd47758c2017e61377bc3), kmod-hwmon-core, kmod-i2c-core, kmod-hwmon-vid
Source: package/kernel/linux
SourceName: kmod-hwmon-w83793
License: GPL-2.0
Section: kernel
Architecture: arc_arc700
Installed-Size: 19491
Description:  Kernel module for the Winbond W83793G and W83793R chips.
