Package: kmod-hwmon-w83793
Version: 4.9.123-1
Depends: kernel (=4.9.123-1-e670b7af30d813349f49d170ae0ab888), kmod-hwmon-core, kmod-i2c-core, kmod-hwmon-vid
Source: package/kernel/linux
License: GPL-2.0
Section: kernel
Architecture: mipsel_mips32
Installed-Size: 15000
Description:  Kernel module for the Winbond W83793G and W83793R chips.
