Package: kmod-hwmon-w83793
Version: 4.4.153-1
Depends: kernel (=4.4.153-1-5910651737f0d42da0bda1561197bf2b), kmod-hwmon-core, kmod-i2c-core, kmod-hwmon-vid
Source: package/kernel/linux
License: GPLv2
Section: kernel
Architecture: mipsel_mips32
Installed-Size: 14301
Description:  Kernel module for the Winbond W83793G and W83793R chips.
