Package: kmod-hwmon-w83793
Version: 4.19.108-1
Depends: kernel (=4.19.108-1-39e09e51d9c06c73187cffa57f1a5a95), kmod-hwmon-core, kmod-i2c-core, kmod-hwmon-vid
Source: package/kernel/linux
SourceName: kmod-hwmon-w83793
License: GPL-2.0
Section: kernel
Architecture: mips_24kc
Installed-Size: 15322
Description:  Kernel module for the Winbond W83793G and W83793R chips.
