Package: kmod-hwmon-w83793
Version: 5.4.108-1
Depends: kernel (=5.4.108-1-d182e29828e68303831a0607075fb28c), kmod-hwmon-core, kmod-i2c-core, kmod-hwmon-vid
Source: package/kernel/linux
SourceName: kmod-hwmon-w83793
License: GPL-2.0
Section: kernel
SourceDateEpoch: 1616320678
Architecture: arm_xscale
Installed-Size: 14394
Description:  Kernel module for the Winbond W83793G and W83793R chips.
