Package: kmod-hwmon-w83793
Version: 4.14.80-1
Depends: kernel (=4.14.80-1-adaae07e6893f6521fa72e03c8cafad5), kmod-hwmon-core, kmod-i2c-core, kmod-hwmon-vid
Source: package/kernel/linux
License: GPL-2.0
Section: kernel
Architecture: arm_xscale
Installed-Size: 13744
Description:  Kernel module for the Winbond W83793G and W83793R chips.
