Package: kmod-hwmon-w83793
Version: 4.14.78-1
Depends: kernel (=4.14.78-1-22f39bc577cc8bce1335653774eb0b0e), kmod-hwmon-core, kmod-i2c-core, kmod-hwmon-vid
Source: package/kernel/linux
License: GPL-2.0
Section: kernel
Architecture: arm_xscale
Installed-Size: 13743
Description:  Kernel module for the Winbond W83793G and W83793R chips.
